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1. general description the uba2212 family of integrated circuits are a range of high voltage monolithic ics for driving compact fluorescent lamps (cfl) in half-bridge configurations. the family is designed to provide easy integration of lamp loads across a range of burner power and mains voltages. 2. features and benefits 2.1 system integration ? integrated half-bridge power transistors ? uba2212c: 120 v; 2 ? ; 3.5 a maximum ignition current ? integrated bootstrap diode ? integrated high-voltage supply 2.2 general ? rms lamp current control 2.3 fast and smoo th light out ? boost with externally controlled timing ? temperature controlled timi ng during boost state ? smooth transition from boost to steady state 2.4 burner lifetime ? fixed frequency preheat with adjustable preheat time ? minimum glow time control to support cold start ? lamp power independent from mains voltage variations ? lamp inductor saturation protection during ignition uba2212 half-bridge power ic family for cfl lamps rev. 3 ? 27 february 2012 product data sheet
uba2212 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 27 february 2012 2 of 18 nxp semiconductors uba2212 half-bridge power ic family for cfl lamps 2.5 safety ? saturation current protection (scp) ? overtemperature protection (otp) ? capacitive mode protection (cmp) 2.6 ease of use ? adjustable operating frequency for easy fit with various burners 3. applications ? compact fluorescent lamps up to 23 w for 120 v (ac) indoor and outdoor applications 4. ordering information table 1. ordering information type number package name description version UBA2212CP/1 dip14 plastic dual inlin e package; 14 leads (300 mil) sot27-1 uba2212ct/1 so14 plastic small outline package; 14 leads; body width 3.9 mm sot108-1
uba2212 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 27 february 2012 3 of 18 nxp semiconductors uba2212 half-bridge power ic family for cfl lamps 5. block diagram fig 1. block diagram aaa-002491 v o(ref)rms otp170 otp120 i sat reset startup uba2212 f osc reset v dd v dd 6 dvdt 5 hv 3 pgnd 4 v dd latch hspt driver hspt fs sense out 14 12 1 rc sw 7 8 cb 9 glow and i sat control pulse voltage controlled oscillator v sw :2 rms control boost/steady preheat preheat boost preheat timer non-overlap timer lspt driver x 2 - v o(ref)rms 2 hs on set csi 10 preheat boost/steady boost/steady v o(ref) v o(ref)bst boost state steady state ls on sgnd 2, 11, 13 lspt boost timer 0.3 v
uba2212 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 27 february 2012 4 of 18 nxp semiconductors uba2212 half-bridge power ic family for cfl lamps 6. pinning information 6.1 pinning 6.2 pin description fig 2. pin configuration for UBA2212CP (sot27-1) f ig 3. pin configuration for uba2212ct (sot108-1) uba2212 out fs sgnd sgnd hv sense pgnd sgnd dvdt csi v dd cb rc sw aaa-000382 1 2 3 4 5 6 7 8 10 9 12 11 14 13 uba2212 out fs sgnd sgnd hv sense pgnd sgnd dvdt csi v dd cb rc sw 001aan336 1 2 3 4 5 6 7 8 10 9 12 11 14 13 table 2. pin description symbol pin description out 1 half-bridge output sgnd 2, 11, 13 signal ground hv 3 high-voltage supply pgnd 4 dvdt supply ground dvdt 5 dvdt supply input v dd 6 internal low-voltage supply output rc 7 internal oscillator input sw 8 sweep timing and vco input cb 9 boost timing capacitor/preheat integrating capacitor csi 10 current feedback sense input sense 12 current sense of ls mosfet fs 14 high-side floating supply output
uba2212 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 27 february 2012 5 of 18 nxp semiconductors uba2212 half-bridge power ic family for cfl lamps 7. functional description 7.1 supply voltage the uba2212 family is powered using a start-up current source and a dvdt supply. when the voltage on pin hv increases, the v dd capacitor (c vdd ) is charged using the internal junction gate field-effect transistor (jfet) current source. the voltage on pin v dd rises until v dd equals v dd(start) . the start-up current source is then disabled. the half-bridge starts switching causing the charge pump to generate the required v dd supply. the amount of current flowing towards v dd equals v hv ? c dvdt ? f where f represents the momentary frequency. the charge pump cons ists of an external half-bridge capacitor (c dvdt ). the ic contains two internal diodes with an internal zener diode. the zener diode ensures the v dd voltage cannot rise above the maximum v dd rating. the dvdt supply has its own ground pin (pgnd) to prevent large peak currents from flowing through the external small signal ground pin (sgnd). the start-up current source is enabled when the voltage on pin v dd is below v dd(stop) . 7.2 start-up state when the supply voltage on pin v dd increases, the ic enters the start-up state. in the start-up state, the high-side power transi stor (hspt) is switched off and the low-side power transistor (lspt) is switched on. the circuit is reset and the capacitors on the bootstrap pin fs (c bs ) and the low-voltage supply pin v dd (c vdd ) are charged. pins rc and sw are switched to ground. when pin v dd is above v dd(start) , the start-up state is exited and the preheat state is entered. if the voltage on pin v dd falls below v dd(stop) , the system return s to the start-up state. remark: if otp is active, the ic rema ins in the start-up state for as long as this is the case. the v dd voltage slowly oscillates between v dd =v dd(stop) and v dd =v dd(start) . 7.3 reset a dc reset circuit is incorporated in the hi gh-side driver. the high-side transistor is switched off when the voltage on pin fs is below the high-side lockout voltage. 7.4 oscillation control the oscillation frequency is based on the 555- timer function. a self oscillating circuit is created comprising the exter nal components: resistors r osc , r sense and capacitor c osc . r osc and c osc determine the nomina l oscillating frequency. an internal divider 0.5 ? f osc(int) is used to generate the accurate 50 % duty cycle. the divider sets the bridge frequency at half the oscillator frequency. the input on pin sw generates signal v sw . the v sw signal is used to determine the frequency in all states except preheat. signal v cb is an internally generated signal used to determine the frequency during the preheat state.
uba2212 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 27 february 2012 6 of 18 nxp semiconductors uba2212 half-bridge power ic family for cfl lamps the output voltage of the bridge changes with the falling edge of the signal on pin rc. the nominal half-bridge frequency is shown in equation 1 : (1) the maximum frequency is 2.5 ? f osc(nom) and is set at v sw . an overview of the oscillator, internal lspt and hspt drive signals and the output is shown in figure 4 . 7.5 preheat state the vco input is directly connected to a fixe d dc voltage of 0.3 v in the preheat state. the frequency is set to about 0.94 f max to ensure voltage mode preheat. the preheat state is finished when v sw drops to 0.3 v. 7.6 ignition state the ignition state is entered after the preheat state has finished. current i sw charges the capacitor on pin sw (c sw ) and the frequency continuously drops. during this frequency sweep (f sw ), the resonance frequency is reached resulting in the ignition of the lamp (see figure 5 ). the lamp inductor (l lamp ) and lamp capacitor (c lamp ) set the resonance frequency. fig 4. oscillator, hspt/lspt drivers and output signals f osc nom ?? 1 k osc r osc ? c osc ? ------------------------------------------- = time (s) v rc v out 0 hspt driver lspt driver half-bridge time (s) time (s) time (s) 001aam035 0 0 0
uba2212 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 27 february 2012 7 of 18 nxp semiconductors uba2212 half-bridge power ic family for cfl lamps 7.7 boost state and tran sition to steady state the boost state is entered after ignition. the output of rms current control circuit and the input of vco are switched to capacitor c sw . at the same time, the input of rms current control circuit is switched to pin csi to sense lamp current. on pin cb, capacitor c cb is connected to the boost timer inpu t to control the boost time. v sw changes to a given voltage to set the lamp current to the level pre-defined by the internal boost reference and resistor r csi . the calculation is shown in equation 2 : (2) when boost timer gives a signal to indicate that boost state is ended, the transition from boost to steady state starts to avoid flicker. in this state, the boost transition timer is active to define the transition time, which is also realized with capacitor c cb on cb pin. 7.8 steady state when the rms current control circuit leaves the system operating at the normal lamp current, it enters the steady state. in this state, the voltage on pin cb is fixed and the voltage on pin sw is controlled by a feedback loop. this feature enables the lamp current to be independent of the mains or lamp voltage. the same analysis as with the boost state can be used to express lamp current ( equation 3 ): (3) fig 5. v lamp , f osc(int) , v cb and v sw plotted against time aaa-002682 preheat v cb v sw vco input steady time (s) ignition and boost transition v lamp f osc(nom) ... ... boost i lamp v ref bst ?? r csi ------------------- = steady i lamp v ref steady ?? r csi -------------------------- =
uba2212 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 27 february 2012 8 of 18 nxp semiconductors uba2212 half-bridge power ic family for cfl lamps therefore, the boost-steady rati o can be found as shown in equation 4 : (4) 7.9 non-overlap time the non-overlap time is defined as the time when both mosfets are not conducting. the non-overlap time is fixed internally and is fixed at the t no value (see ta b l e 5 ). 7.10 overtemperature protection (otp) otp is active in all states except boost. when the die temperature reaches the otp activation threshold (t th(act)otp ), the oscillator is stopp ed and the power switches (lspt/hspt) are set to the start-up state. when the oscillator is stopped, the dvdt supply no longer generates the supply current i dvdt . voltage v dd gradually decreases and the start-up state is entered as described in section 7.2 on page 5 . otp is reset when the temperature < t th(rel)otp . during boost state, the threshold of temperature is t j(end)bst which is lower than t th(otp) . when the die temperature has reached t j(end)bst , the boost state ends, the ic enters steady state and otp is enabled. 7.11 saturation current protection (scp) a critical parameter in the design of the lamp inductor is its saturation current. when the momentary inductor exceeds its saturation current, the inductance drops significantly. the inductor current and the current flowing th rough the lspt and hspt power switches increases rapidly if this happens. the increase can cause the current to exceed the half-bridge power transistors maximum ratings. saturation of the lamp inductor is likely to occur in cost-effective and miniaturized cfls. the uba2212 family internally monitors the power transistor current. when this current exceeds the momentary rating of the internal half-bridge power transistors, the conduction time is reduced and the frequency is slowly increased (by discharging c sw ). this function causes the system to balance at the edge of the current rating of the power switches. 7.12 capacitive mode protection (cmp) in boost and steady state, v sw determines the operating frequency. the rms current control circuit and the cmp circuit control this frequency. when capacitive mode is detected, capacitor c sw is mainly controlled by the cmp circuit. capacitor c sw is discharged by a current source, which is also dependent on the hard switching voltage level. the operating frequency f osc , increases until cmp is no longer detected. remark: cmp always controls the operation. if the lamp current is lower than the defined value before cmp is detected, the system mo ves to the edge of hard switching (~25 v). the set value cannot be achieved. change the lc tank to get a higher resonant gain, which enables the required lamp current to be obtained. boost to steady ratio v ref bst ?? v ref steady ?? -------------------------- =
uba2212 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 27 february 2012 9 of 18 nxp semiconductors uba2212 half-bridge power ic family for cfl lamps 8. limiting values [1] in accordance with the human body model (hbm): equi valent to discharging a 100 pf capacitor through a 1.5 k ? series resistor. 9. thermal characteristics [1] in accordance with iec 60747-1 table 3. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v hv voltage on pin hv operating - 202 v mains transients during 0.5 s - 250 v v fs voltage on pin fs v hv v hv +14 v v dd supply voltage dc supply 0 14 v v sense voltage on pin sense ? 5+5 v v rc voltage on pin rc i rc <1ma 0 v dd v v sw voltage on pin sw i sw <1ma 0 v dd v i out current on pin out t j <125 ?c ? 3.5 +3.5 a i dvdt current on pin dvdt t j <125 ?c ? 2.5 +2.5 a v i(csi) input voltage on pin csi t j > ? 40 ?c ? 3.5 +3.5 v sr slew rate repetitive output on pin out ? 4+4 v/ns t j junction temperature ? 40 +150 ? c t amb ambient temperature ? 40 +150 ? c t stg storage temperature ? 55 +150 ? c v esd electrostatic discharge voltage human body model (hbm): [1] pins hv, fs, out - 800 v pins sw, rc, v dd , dvdt - 2.5 kv charged device model (cdm): pins sw, rc, v dd , dvdt, csi and cb -400v table 4. thermal characteristics symbol parameter conditions typ unit dip14 package r th(j-a) thermal resistance from junction to ambient in free air [1] 70 k/w r th(j-c) thermal resistance from junc tion to case in free air [1] 16 k/w so14 package r th(j-a) thermal resistance from junction to ambient in free air [1] 95 k/w r th(j-c) thermal resistance from junc tion to case in free air [1] 16 k/w
uba2212 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 27 february 2012 10 of 18 nxp semiconductors uba2212 half-bridge power ic family for cfl lamps 10. characteristics table 5. characteristics t j = 25 ? c; all voltages are measured with respect to sgnd; positive currents flow into the ic. symbol parameter conditions min typ max unit low-voltage supply start-up state i hv current on pin hv v hv =60v - 1.5 - ma v dd(start) start supply voltage oscillation start 11.5 12.5 13.5 v v dd(stop) stop supply voltage oscillation stop 8.5 9 9.5 v v dd(hys) hysteresis of supply voltage start ? stop 3 3.5 4 v v dd(reg) regulation supply voltage - 12.5 - v i sink sink current capability of vdd regulator 6 - - ma output stage r on on-state resistance hs; v hv = 170 v; i d = 200 ma - 2 - ? ls; v hv =170v; i d = 200 ma - 2 - ? r on(150) / r on(25) on-state resistance ratio (150 ? cto25?c) -1.4- v fd diode forward voltage hs; i f =320ma - 1.1 - v ls; i f =320ma - 1.2 - v bootstrap diode; i f = 1 ma 0.7 1 1.3 v t no non-overlap time 0.9 1.2 1.5 ? s v fs voltage on pin fs undervoltage lockout with respect to pin out 3.9 4.5 5.1 v i fs current on pin fs v hv =170v; v fs = 12 v 10 14 18 ? a i sat saturation current hs; v ds =14v; t j ? 125 ?c3 . 5 --a ls; v ds =14v; t j ? 125 ? c3 . 5 - - a internal oscillator f osc(min) minimum oscillator frequency r osc =100k ? ; c osc =220pf; v sw =v dd - 36 - khz f osc(max) maximum oscillator frequency r osc =100k ? ; c osc =220pf; v sw = 0 v - 104 - khz ? f osc(nom) / ? t nominal oscillator frequency variation with temperature r osc =100k ? ; c osc =220pf; ? t=? 20 to +150 ?c -2-% k h high-level trip point factor 0.36 0.38 0.50 k l low-level trip point factor 0.018 0.029 0.040 v h(rc) high-level voltage on pin rc trip point; v h(rc) =k h ? v dd 4.45 4.78 5.20 v v l(rc) low-level voltage on pin rc trip point; v l(rc) =k l ? v dd 0.255 0.362 0.455 v k osc oscillator constant r osc =100k ? ; c osc = 220 pf 1.065 1.1 1.135 preheat function t ph preheat time c sw = 47 nf - 0.55 - s f ph preheat frequency r osc =100k ? ; c osc = 220 pf - 90 - khz v rc voltage on pin rc trip point during preheat state - 0.3 - v
uba2212 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 27 february 2012 11 of 18 nxp semiconductors uba2212 half-bridge power ic family for cfl lamps boost function v o(ref)bst boost reference output voltage v dd =12v; h v =30v; v sw = 3 v - 450 - mv t j(end)bst boost end junction temperature - 90 - ?c t bst boost time c sw = 220 nf - 48 - s t t transition time c sw = 220 nf - 2 - s steady function v o(ref) steady reference output voltage v dd =12v; h v =30v; v sw = 3 v - 300 - mv n lcbr lamp current boost ratio boost and steady state - 1.5 - otp function t th(act)otp overtemperature protection activation threshold temperature - 170 - ?c t th(rel)otp overtemperature protection release threshold temperature - 100 - ?c table 5. characteristics ?continued t j = 25 ? c; all voltages are measured with respect to sgnd; positive currents flow into the ic. symbol parameter conditions min typ max unit
uba2212 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 27 february 2012 12 of 18 nxp semiconductors uba2212 half-bridge power ic family for cfl lamps 11. application information fig 6. application diagram 001aan371 r fuse d3 c buf c5 c8 c7 c6 l2 r csi c dvdt c osc c cb c vdd r osc c sw c fs l filt d2 d4 d1 u1 out 114 fs sgnd 213 sgnd hv 312 sense pgnd 411 sgnd dvdt 510 csi v dd 69 cb rc 78 sw cfl ac input l_n l_l uba2212 table 6. bill of materials number reference typical value quantity 1r fuse 10 ? ; 1 w - no value for fuse resistor 1 2 d1, d2, d3, d4 diode, 1 a; 1000 v; 1n4007 4 3c buf electrolytic capacitor; 33 ? f; 250 v; 105 ?c1 4l filt inductor; 3 mh; 0.5 a 1 5c dvdt ceramic capacitor; 330 pf; 500 v; 1206 1 6c fs ceramic capacitor; 22 nf; 50 v; 0805 1 7c b ceramic capacitor; 220 nf; 50 v; 0805 1 8c sw ceramic capacitor; 68 nf; 50 v; 0805 1 9c osc ceramic capacitor; 220 pf; 50 v; 0805 1 10 c vdd ceramic capacitor; 100 nf; 50 v; 0805 1 11 r osc chip resistor; 100 k ? ; 5 %; 0805 1 12 c6; c7 film capacitor; 82 nf; 100 v 2 13 c5 film capacitor; 6.8 nf; 1 kv 1 14 c8 film capacitor; 8.2 nf; 400 v 1 15 r csi chip resistor; 1.8 ? ; 1 %; 0.25 w 1 16 l2 pc40-ee16; 1.5 mh; 1 a; n = 180 : 6 : 6; diameter 0.23 mm 1 18 u1 uba2213ct; so14 1 19 burner burner; t3 spiral 20 w 1
uba2212 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 27 february 2012 13 of 18 nxp semiconductors uba2212 half-bridge power ic family for cfl lamps 12. package outline fig 7. package outline sot27-1 (dip14) unit a max. 1 2 (1) (1) b 1 cd (1) z ee m h l references outline version european projection issue date iec jedec jeita mm inches dimensions (inch dimensions are derived from the original mm dimensions) sot27-1 99-12-27 03-02-13 a min. a max. b max. w m e e 1 1.73 1.13 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 2.2 4.2 0.51 3.2 0.068 0.044 0.021 0.015 0.77 0.73 0.014 0.009 0.26 0.24 0.14 0.12 0.01 0.1 0.3 0.32 0.31 0.39 0.33 0.087 0.17 0.02 0.13 050g04 mo-001 sc-501-14 m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 14 1 8 7 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. dip14: plastic dual in-line package; 14 leads (300 mil) sot27-1
uba2212 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 27 february 2012 14 of 18 nxp semiconductors uba2212 half-bridge power ic family for cfl lamps fig 8. package outline sot108-1 (so14) unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz ywv references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot108-1 x w m a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 7 8 1 14 y 076e06 ms-012 pin 1 index 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.35 0.34 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 99-12-27 03-02-19 0 2.5 5 mm scale so14: plastic small outline package; 14 leads; body width 3.9 mm sot108-1
uba2212 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 27 february 2012 15 of 18 nxp semiconductors uba2212 half-bridge power ic family for cfl lamps 13. revision history table 7. revision history document id release date data sheet status change notice supersedes uba2212 v.3 20120227 product data sheet - uba2212 v.2 modifications: ? data sheet status changed from preliminary to product. ? text and drawings updated throughout entire data sheet. uba2212 v.2 20120209 preliminary data sheet - uba2212 v.1 uba2212 v.1 20111209 objective data sheet - -
uba2212 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 27 february 2012 16 of 18 nxp semiconductors uba2212 half-bridge power ic family for cfl lamps 14. legal information 14.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 14.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? 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stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
uba2212 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 27 february 2012 17 of 18 nxp semiconductors uba2212 half-bridge power ic family for cfl lamps export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 14.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 15. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors uba2212 half-bridge power ic family for cfl lamps ? nxp b.v. 2012. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 27 february 2012 document identifier: uba2212 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 16. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 2.1 system integration . . . . . . . . . . . . . . . . . . . . . . 1 2.2 general . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.3 fast and smooth light out . . . . . . . . . . . . . . . . . 1 2.4 burner lifetime . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.5 safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.6 ease of use. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 functional description . . . . . . . . . . . . . . . . . . . 5 7.1 supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.2 start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.3 reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.4 oscillation control . . . . . . . . . . . . . . . . . . . . . . . 5 7.5 preheat state . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.6 ignition state . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.7 boost state and transition to steady state. . . . . 7 7.8 steady state . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7.9 non-overlap time . . . . . . . . . . . . . . . . . . . . . . . 8 7.10 overtemperature protection (otp) . . . . . . . . . 8 7.11 saturation current protec tion (scp) . . . . . . . . 8 7.12 capacitive mode protection (cmp) . . . . . . . . . 8 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 thermal characteristics . . . . . . . . . . . . . . . . . . 9 10 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 10 11 application information. . . . . . . . . . . . . . . . . . 12 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 13 revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 14 legal information. . . . . . . . . . . . . . . . . . . . . . . 16 14.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 14.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 14.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 14.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 15 contact information. . . . . . . . . . . . . . . . . . . . . 17 16 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

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